Advanced Chip Packaging Market Set to Reach US$52.7 Billion by 2030, Driven by Growing Demand for Miniaturization and Enhanced Performance

The global advanced chip packaging market is on a trajectory of robust growth, with market valuation expected to surge from US$30.2 billion in 2022 to a projected US$52.7 billion by 2030, showcasing a nearly 8.3% compound annual growth rate (CAGR) between 2023 and 2030, according to a comprehensive market analysis

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Infimobile’s eSIM Launch Revolutionizes Mobile Connectivity: Here’s Your Comprehensive Guide

–News Direct– In the dynamic realm of telecommunications, Infimobile emerges as a trailblazer, pushing boundaries with its recent introduction of eSIM technology. This groundbreaking move signifies a transformative shift in mobile connectivity, delivering heightened flexibility and convenience to consumers. The advent of eSIM, or embedded SIM, represents a departure from conventional

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